● Probe and Fixture:

(1) The probe adopts a large array element design.

(2) The effective beam coverage width can reach 120mm, greatly improving the detection efficiency;

(3) It is equipped with a spring pressure mechanism to ensure good coupling between the ultrasonic probe and the workpiece.

●Automatic Analysis:

   Large inspection areas require 2D scanning, with the C-scan image updated synchronously during scanning. 

   After testing, the software automatically analyzes data. Following gate settings, it identifies under-filled and poorly bonded regions in the 2D C-scan,calculates their areas, and subtracts them from the total area to derive the effective bonding area.

● Visualization Operation:

    Tests on bonded samples show phased array ultrasonic images closely match the actual adhesive profile revealed by destructive dissection, verifying the feasibility of this NDT technology for bonding quality inspection.

● Intelligent Judgment

   After the inspection is completed, the system determines whether the current inspection object is qualified based on the set effective adhesive area required for qualification. If qualified, it displays "OK" and is processed as a qualified product; if unqualified, it displays "NG" alarm and is processed as an unqualified product.