The 3rd International Summit on Liquid Cooling & Heat Dissipation Supply Chain for AI Data Centers was successfully held in Shenzhen on May 21–22, 2026. The event was hosted by Shanghai Wenyaohuixin and co-organized by Shanghai Jiao Tong University.

The exponential growth of artificial intelligence and high-performance computing is profoundly reshaping the landscape of data centers. As the power density of AI chips continues to push beyond the limits of traditional air cooling, liquid cooling has evolved from an emerging alternative into critical infrastructure for the sustainable and efficient operation of data centers.

This summit aims to build a top-tier professional exchange platform for the industry to address this pivotal transition. Going beyond theoretical discussions alone, it delivers comprehensive and in-depth analysis across the entire technical chain concerning innovations in materials, components and system solutions for next-generation thermal management, covering the full spectrum of technologies ranging from chip-level heat dissipation to data center-scale cooling architectures.

Doppler Attends the Summit

       At this summit, Doppler showcased its advanced phased array ultrasonic automatic testing system for liquid cooling plates. Integrating high-speed detection and intelligent defect analysis, the system won wide acclaim from all attendees. Yin Lu, Director of Applied Technology at Doppler, also delivered a speech titled Phased Array Ultrasonic Automatic Detection and AI Intelligent Evaluation Technology for Cold Plate Welds, which was met with warm applause.

       
       Doppler Booth：

Doppler's Speech：

Doppler PA Ultrasonic Automated Testing System for Liquid Cooling Plates

       The phased array immersion automated system for liquid cooling plates is designed for high-precision imaging inspection of weld quality on liquid cooling plates. Adopting specially customized processes, the system delivers an inspection precision equivalent to a flat-bottomed hole of φ0.2 mm, and can even detect defects as small as φ0.1 mm under extreme conditions. It serves as an optimal solution for high-end immersion inspection requirements.

Compatible with liquid cooling plates of various specifications, this system can also be extended to immersion inspection for automotive parts, aerospace components and precision parts.

       Inspection Results of Liquid Cooling Plates：